A good transmitter not only requires high performance indicators, but also good long-term stability.
The stability of the transmitter depends on factors such as the rationality of the design, the performance of components and the manufacturing process of the whole machine.
The stability of the transmitter will gradually be exposed during long-term use. For example, silicon chip surface contamination, structural instability, welding voids, chip and shell thermal resistance mismatch, etc.
The aging process of the transmitter is an effective means to improve the stability and reliability of the transmitter.
Through the transmitter aging test, the defects of transmitter components, welding and assembly and other hidden dangers in the production process can be exposed in advance, ensuring that the transmitter leaving the factory can stand the test of time.
Transmitter aging tests generally include high-temperature storage aging, high-low temperature cycle aging, high-low temperature impact aging, and high-temperature power aging.
Among them, high-temperature power aging is to power on the transmitter to simulate actual working conditions.
The transmitter is subjected to a few hours of low temperature of about -40°C or high temperature of about 80°C. It is an effective means to detect potential faults of transmitter components.
As a manufacturer of transmitters, we conduct comprehensive aging tests on transmitters and master their aging time, laying a solid foundation for improving transmitter quality, reducing device costs, and improving product competitiveness.