Analysis of Factors Affecting Interlock Action Reliability - Just Measure it

Analysis of Factors Affecting Interlock Action Reliability

Purpose. This note summarizes why interlock functions may mis-actuate or fail to act, and what to do about it—covering instruments, logic design, installation/maintenance, and people/process.

1) Instrument-Related Factors

  • Quality & accuracy. Low-cost, mixed-quality instruments degrade stability/accuracy and raise the risk of spurious trips and nuisance alarms when used as interlock initiators.

  • Aging & wear. Sensing elements and electronics drift and fail over time. Examples: DP transmitters and remote seal level transmitters can suffer from silicone oil aging/leakage; electronics in harsh refinery/petrochemical environments face wide temperature swings, vibration, and corrosive/toxic media that shorten life.

  • Mismatched selection. Poor fit to service conditions leads to failure modes that propagate into the logic. Example: using an orifice plate on heavy, dirty oil can clog impulse lines; if that flow tag participates in an interlock, it may trigger a false trip.

Mitigations

  • Specify certified accuracy/stability for safety-related tags; use proven-in-use models.

  • Apply lifecycle proof-test intervals based on PFD_avg targets.

  • Select technology for the fluid and fouling risk (e.g., vortex/Coriolis for dirty/heavy fluids; purge/heat-trace impulse lines; remote seals as needed).

2) Interlock (Logic) Design Factors

  • Insufficient redundancy. Single-sensor trips are vulnerable to any single bad reading or wiring issue, causing spurious trips.

  • Unbalanced voting. Two sensors where one is faulty can mask demand (refuse-to-trip) or produce indeterminate states.

  • Power/IO single points. Single power supply or placing redundant channels on the same IO card creates common-cause failure; a supply dip or card fault can force an unintended trip.

Mitigations

  • Use appropriate voting (1oo2, 2oo3) for hazard rate vs. spurious trip trade-offs; include quality/status in the vote.

  • Physically separate redundant channels (different cards, marshalling, junction boxes, conduits).

  • Provide redundant, monitored power and watchdogs; add diagnostic alarms distinct from safety trips.

3) Installation & Maintenance Factors

  • Wiring workmanship. Damaged insulation, strained cables, poor terminations, or loose screws create intermittent faults and noise pickup that appear as process excursions.

  • Maintenance gaps. Lack of routine cleaning, calibration, and impulse-line care allows zero drift, plugging, or sluggish response to go unnoticed.

  • Weak diagnostics. Missing or ignored self-diagnostics means faults are only recognized after a trip or a process upset.

Mitigations

  • Enforce installation standards (shielding/earthing, separation from high-EMI sources, proper glands, torque specs).

  • Establish PM/proof-test plans: impulse-line inspection, zero/span checks, filter/drain routines, transmitter health review.

  • Configure and routinely review device diagnostics; escalate bad-actors to root-cause analysis.

4) People, Procedures & Training

  • Low managerial attention. Without end-to-end ownership—from design/specification through procurement, installation, and O&M—small gaps compound into major incidents (per Heinrich’s Law).

  • Operator training gaps. When an interlock fires, operators may not know the initiating conditions, correct reset sequence, or permissive logic—delaying recovery and increasing losses.

Mitigations

  • Assign lifecycle ownership for each interlock (design → validation → operations → MOC).

  • Provide targeted training and simulations: initiating conditions, cause & effect, permissives, reset logic, and post-trip checks.

  • Keep Cause & Effect (C&E) and bypass/reset procedures up-to-date and at the console.

Quick Reference: Common Failure Modes & Countermeasures

AreaTypical failure modeEffect on interlockPractical countermeasure
SensingImpulse line plugging (DP/flow/level)False high/low → spurious trip or refuse-to-tripPurged lines, heat tracing, remote seals, clog-resistant tech
ElectronicsZero/span drift with temperature/ageTrip at wrong thresholdPeriodic calibration; temperature-rated devices; diagnostics
LogicSingle sensor 1oo1High spurious trip rateMove to 1oo2 or 2oo3 with status-aware voting
IO/PowerRedundant channels on one cardCommon-cause tripSplit cards, separate marshalling, dual PSUs
Wiring/EMCLoose terminations/EMI couplingNoise → false measurementTermination QA, shielding/grounding, cable segregation
ProceduresUnclear reset/permissivesProlonged downtimeConsole guides, drills, clear C&E tables

Minimal Acceptance Checklist (use before handover)

  • Sensors/transmitters: model qualified, SIL suitability checked, diagnostics enabled, proof-test interval defined.

  • Logic: voting set and validated (FAT/SAT), channel segregation verified, fault insertion tests passed.

  • Power/IO: redundant supplies with monitoring; redundant inputs on separate cards/paths.

  • Installation: cabling/earthing inspected; as-built drawings updated.

  • O&M: PM and proof-test plans issued; operator training completed; C&E and reset/bypass procedures published.

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